Intel’s been trying to recapture its glory days and establish itself, once again, as a leading chipmaker. However, this dream has run into a major snag. The company’s next-gen manufacturing process, currently referred to as 18A, has reportedly failed crucial tests, according to Reuters.
Semiconductor developer Broadcom helped conduct these tests as part of an evaluation process for a potential order. The report indicates that Intel sent Broadcom’s silicon wafers, which are the components used to form the base of a semiconductor, through the 18A manufacturing process, which is supposed to increase efficiency. Broadcom was reportedly not happy with the
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