The US Department of Commerce introduced a sweeping package of export controls on Monday designed to weaken China’s domestic semiconductor ecosystem and undermine the country’s ability to manufacture advanced chips locally. The new regulations prevent China from accessing 24 types of chip manufacturing equipment and three software programs, and place restrictions on the sale to China of high-bandwidth memory, or HBM, an advanced kind of 3D-stacked computer memory component that is often used in customized AI chips.
“They’re the strongest controls ever enacted by the US to degrade the PRC’s ability to make the most advanced chips that they’re using in their military modernization,” Commerce Secretary Gina Raimondo said on
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